印制电路板在服役环境中的腐蚀失效行为研究进展
Research Progress on Corrosion Failure Behavior of Printed Circuit Board in a Service Environment
印制电路板在服役环境中的腐蚀失效行为研究进展 |
| 刘元海, 李玉珠, 郁大照, 慕仙莲, 刘杰 |
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Research Progress on Corrosion Failure Behavior of Printed Circuit Board in a Service Environment |
| LIU Yuanhai, LI Yuzhu, YU Dazhao, MU Xianlian, LIU Jie |
| 图4 PCB-ENIG镀金层表面缺陷以及1个月后的截面形貌照片[ |
| Fig.4 SEM image of the defect existing in the gold-plated layer on PCB-ENIG (a) and cross section after 1 month (b)[ |
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