印制电路板在服役环境中的腐蚀失效行为研究进展
Research Progress on Corrosion Failure Behavior of Printed Circuit Board in a Service Environment
印制电路板在服役环境中的腐蚀失效行为研究进展 |
| 刘元海, 李玉珠, 郁大照, 慕仙莲, 刘杰 |
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Research Progress on Corrosion Failure Behavior of Printed Circuit Board in a Service Environment |
| LIU Yuanhai, LI Yuzhu, YU Dazhao, MU Xianlian, LIU Jie |
| 图3 在1.2 V电压、盐浓度为1~30 µg/m3的条件下PCB腐蚀预测[ |
| Fig.3 Predicted corrosion of PCB under the condition of 12 V and salt concentration of 1-30 µg/m3 [ |
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