L-苹果酸和2,2'-联二吡啶对酒石酸钾钠体系低温化学镀铜的影响

朱皓, 程熠, 宋晅, 赵文霞, 李鑫巍, 刘欣, 回凯宏, 陈怀军, 翟世龙

Effect of L-malic Acid and 2,2'-bidipyridine on Electroless Copper Plating in Potassium Sodium Tartrate System at Low Temperature

ZHU Hao, CHENG Yi, SONG Xuan, ZHAO Wenxia, LI Xinwei, LIU Xin, HUI Kaihong, CHEN Huaijun, ZHAI Shilong

图7 不同添加剂条件下镀铜层表面照片

Fig.7 Surface photos of electroless plating copper under the conditions of adding different agents: (a) without additional reagent, (b) 2 mg/L L- malic acid, (c) 1 mg/L 2,2'-bidipyridine, (d) 2 mg/L L- malic acid and 1 mg/L 2,2'-bidipyridine