L-苹果酸和2,2'-联二吡啶对酒石酸钾钠体系低温化学镀铜的影响
Effect of L-malic Acid and 2,2'-bidipyridine on Electroless Copper Plating in Potassium Sodium Tartrate System at Low Temperature
L-苹果酸和2,2'-联二吡啶对酒石酸钾钠体系低温化学镀铜的影响 |
| 朱皓, 程熠, 宋晅, 赵文霞, 李鑫巍, 刘欣, 回凯宏, 陈怀军, 翟世龙 |
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Effect of L-malic Acid and 2,2'-bidipyridine on Electroless Copper Plating in Potassium Sodium Tartrate System at Low Temperature |
| ZHU Hao, CHENG Yi, SONG Xuan, ZHAO Wenxia, LI Xinwei, LIU Xin, HUI Kaihong, CHEN Huaijun, ZHAI Shilong |
| 图6 化学镀铜沉积速率随L-苹果酸和2,2'-联二吡啶复合添加浓度的变化趋势 |
| Fig.6 Variations of the deposition rate of electroless plating copper with the addition concentration of both L-malic acid and 2,2'-bidipyridine |
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