L-苹果酸和2,2'-联二吡啶对酒石酸钾钠体系低温化学镀铜的影响
Effect of L-malic Acid and 2,2'-bidipyridine on Electroless Copper Plating in Potassium Sodium Tartrate System at Low Temperature
L-苹果酸和2,2'-联二吡啶对酒石酸钾钠体系低温化学镀铜的影响 |
| 朱皓, 程熠, 宋晅, 赵文霞, 李鑫巍, 刘欣, 回凯宏, 陈怀军, 翟世龙 |
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Effect of L-malic Acid and 2,2'-bidipyridine on Electroless Copper Plating in Potassium Sodium Tartrate System at Low Temperature |
| ZHU Hao, CHENG Yi, SONG Xuan, ZHAO Wenxia, LI Xinwei, LIU Xin, HUI Kaihong, CHEN Huaijun, ZHAI Shilong |
| 图1 不同微蚀时间下ABS基体表面SEM图 |
| Fig.1 SEM images of ABS substrates after etching for 10 min (a), 15 min (b), 20 min (c) and 25 min (d) |
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