Cu/Ag活化对微弧氧化涂层表面化学镀层生长及耐蚀性能的影响

田卫平, 郭良帅, 王宇航, 周鹏, 张涛

Effect of Cu-/Ag-activation on Growth and Corrosion Resistance of Electroless Plated Ni-film on Plasma Electrolytic Oxidation Coating

TIAN Weiping, GUO Liangshuai, WANG Yuhang, ZHOU Peng, ZHANG Tao

表3 电化学阻抗谱的拟合结果

Table 3 Fitted parameters of the EIS data

Sample CPEf / Ω-1·cm-2·s n nf Rf / Ω cm2 CPEdl / Ω-1·cm-2·s n n2 Rct / Ω·cm2 RL / Ω·cm2 L / H·cm-2 AZ91D 1.20×10-5 0.94 451.7 4.15×10-4 0.42 802.50 392.8 61.98 PEO-Cu-EN 9.27×10-8 1 8.665 3.83×10-5 0.90 2.85×104 --- --- PEO-Ag-EN 5.08×10-5 0.96 1.50×104 8.26×10-5 0.90 3.37×104 --- --- PEO-Pd-EN 7.41×10-4 0.94 1.04×104 3.39×10-5 0.94 3.66×104 --- ---