Cu/Ag活化对微弧氧化涂层表面化学镀层生长及耐蚀性能的影响

田卫平, 郭良帅, 王宇航, 周鹏, 张涛

Effect of Cu-/Ag-activation on Growth and Corrosion Resistance of Electroless Plated Ni-film on Plasma Electrolytic Oxidation Coating

TIAN Weiping, GUO Liangshuai, WANG Yuhang, ZHOU Peng, ZHANG Tao

表1 EDS分析结果

Table 1 Composition of the coatings by EDS (mass fraction / %)

Position O Mg Al Si S Cu Ag PEO 52.05 27.64 2.81 17.50 --- --- --- A 52.79 6.66 0.45 5.76 5.08 29.26 --- B 30.39 19.80 2.57 9.04 --- 38.20 --- Cu-activation 45.47 27.76 3.42 16.65 --- 6.70 --- C 46.77 26.55 3.30 16.39 --- --- 6.99 D 55.73 24.34 1.91 8.53 --- --- 9.50 Ag-activation 52.41 29.12 3.12 13.63 --- --- 1.72