Cu/Ag活化对微弧氧化涂层表面化学镀层生长及耐蚀性能的影响

田卫平, 郭良帅, 王宇航, 周鹏, 张涛

Effect of Cu-/Ag-activation on Growth and Corrosion Resistance of Electroless Plated Ni-film on Plasma Electrolytic Oxidation Coating

TIAN Weiping, GUO Liangshuai, WANG Yuhang, ZHOU Peng, ZHANG Tao

图8 Cu/Ag/Pd活化处理后浸镀3、10和30 min后镀层表面和浸镀30 min后镀层截面的SEM像

Fig.8 SEM images of PEO-Cu-EN (a), PEO-Ag-EN (b) and PEO-Pd-EN (c) coatings surface morphology after 3 min (a1-c1), 10 min (a2-c2), 30 min (a3-c3) dipping process and SEM image of PEO-EN coating cross-section morphology after 30 min dipping process (a4-c4)