大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制

马小泽, 孟令东, 曹祥康, 肖松, 董泽华

Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board

MA Xiaoze, MENG Lingdong, CAO Xiangkang, XIAO Song, DONG Zehua

表2 30 ℃,RH90%条件下表面沉积不同比例盐粒72 h时铜梳齿电极的EIS拟合结果

Table 2 Fitting results of comb-like Cu electrode after surface deposition with different proportions of mixed salt particles at 30 ℃ and RH90% for 72 h

Ratio of NaCl / (NH₄)₂SO₄	R_s / Ω·cm²	R_ct / Ω·cm²	C_dl / F·cm^-2 Hz^1-ⁿ	C_dl-n	W / Ω·cm²
4:0	5.6	613	1.001×10^-6	0.40	5.10×10³
3:1	10.8	2255	6.992×10^-6	0.57	9.95×10³
2:2	44.45	3248	7.882×10^-6	0.48	1.13×10⁵
1:3	99.8	824	5.292×10^-8	0.84	2.96×10⁴
0:4	174.3	6.05×10⁴	1.247×10^-10	0.85	1.52×10⁴