大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制

马小泽, 孟令东, 曹祥康, 肖松, 董泽华

Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board

MA Xiaoze, MENG Lingdong, CAO Xiangkang, XIAO Song, DONG Zehua

表1 沉积不同比例盐粒的梳齿铜电极在30 ℃,RH80%下暴露72 h后的EIS拟合结果

Table 1 Fitting results of EIS of comb-like Cu electrodes with surface deposition of different proportions of mixed salt particles after exposure at 30 ℃ and RH80% for 72 h

Ratio:NaCl / (NH4)2SO4 RTEL / Ω·cm2 Rct / Ω·cm2 CPEdl / F·cm-2 Hz1-n CPEdl-n W / Ω·cm2 4:0 3.9 4811 1.79×10-8 0.41 1.14×104 3:1 5.2 5900 3.72×10-7 0.54 2.88×104 2:2 479 5.95×104 1.25×10-10 0.77 2.75×105 1:3 94.37 1.09×105 2.83×10-8 0.73 2.81×105 0:4 402.3 1.19×106 7.74×10-10 0.92 1.19×104