大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制

马小泽, 孟令东, 曹祥康, 肖松, 董泽华

Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board

MA Xiaoze, MENG Lingdong, CAO Xiangkang, XIAO Song, DONG Zehua

图11 未沉积和沉积不同比例盐粒的铜试样在30 ℃和RH90%条件下暴露3 d后的微观腐蚀形貌

Fig.11 Corrosion morphologies of copper specimens deposited with the mass ratio of NaCl 0:0 (a), 4:0 (b), 3:1 (c), 2:2 (d), 1:3 (e) and 0:4 (f) of salt particles after exposure at 30 ℃ and RH90% for 3 d