大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制
Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board
大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制 |
| 马小泽, 孟令东, 曹祥康, 肖松, 董泽华 |
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Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board |
| MA Xiaoze, MENG Lingdong, CAO Xiangkang, XIAO Song, DONG Zehua |
| 图10 沉积40 µg/cm2 NaCl,NaCl: (NH4)2SO4 (1:1),(NH4)2SO4的Cu在30 ℃和RH90%条件下暴露3 d后表面XPS谱图 |
| Fig.10 XPS spectra of Cu 2P, S 2P, C 1s of Cu specimen deposited with 40 µg/cm2 NaCl, mixture of NaCl and (NH4)2SO4 (1:1) and (NH4)2SO4 after exposure at 30 ℃ and RH90% for 3 d |
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