大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制

马小泽, 孟令东, 曹祥康, 肖松, 董泽华

Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board

MA Xiaoze, MENG Lingdong, CAO Xiangkang, XIAO Song, DONG Zehua

图9 表面沉积不同比例盐粒的铜片在30 ℃,RH90%条件下暴露72 h后的腐蚀产物XRD图

Fig.9 XRD patterns of corrosion products formed on Cu specimen deposited with different proportions of salt particles after exposure at 30℃ and RH90% for 72 h