大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制

马小泽, 孟令东, 曹祥康, 肖松, 董泽华

Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board

MA Xiaoze, MENG Lingdong, CAO Xiangkang, XIAO Song, DONG Zehua

图8 在30 ℃和RH90%条件下暴露时Cu箔的厚度损失以及腐蚀速率随时间及盐粒比例的变化曲线

Fig.8 Variations of thickness loss (a, c) and corrosion rate (b) of thin Cu electrical resistance probe with corrosion time and proportion of deposited salt particles during exposure at 30 ℃ and RH90%