大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制
Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board
大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制 |
| 马小泽, 孟令东, 曹祥康, 肖松, 董泽华 |
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Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board |
| MA Xiaoze, MENG Lingdong, CAO Xiangkang, XIAO Song, DONG Zehua |
| 图6 沉积不同比例硫酸钠,硫酸铵和NaCl盐粒的铜梳齿电极在30 ℃,RH90%条件下暴露时的|Z|0.01 Hz对比图 |
| Fig.6 Comparison of |Z|0.01 Hz of the comb-like electrodes with surface deposition of different proportions of sodium sulfate, ammonium sulfate and sodium chloride salt particles after exposure at 30 ℃ and RH90% |
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