大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制
Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board
大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制 |
| 马小泽, 孟令东, 曹祥康, 肖松, 董泽华 |
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Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board |
| MA Xiaoze, MENG Lingdong, CAO Xiangkang, XIAO Song, DONG Zehua |
| 图5 沉积不同比例盐粒下铜梳齿电极在30 ℃,RH90%气候箱中暴露时低频阻抗随时间的变化 |
| Fig.5 Time dependences of low-frequency impedance |Z|0.01 Hz of the comb-like electrodes with surface deposition of different proportions of salt particles during exposure at 30 ℃ and RH90% |
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