大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制

马小泽, 孟令东, 曹祥康, 肖松, 董泽华

Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board

MA Xiaoze, MENG Lingdong, CAO Xiangkang, XIAO Song, DONG Zehua

图4 沉积不同比例混合盐粒的铜梳齿电极在30 ℃,RH90%气候箱中暴露72 h后的EIS曲线

Fig.4 EIS of the comb-like Cu electrodes with surface deposition of different proportions of mixed salt particles after exposure in the weathering chamber at 30 ℃ and RH90% for 72 h