大气污染物硫酸铵和氯化钠混合盐粒沉降对电路板铜大气腐蚀的加速机制

马小泽, 孟令东, 曹祥康, 肖松, 董泽华

Influence of Co-deposition of Pollutant Particulates Ammonium Sulfate and Sodium Chloride on Atmospheric Corrosion of Copper of Printed Circuit Board

MA Xiaoze, MENG Lingdong, CAO Xiangkang, XIAO Song, DONG Zehua

图3 沉积40 µg/cm2 (NH4)2SO4或NaCl盐粒的铜梳齿电极在30 ℃,不同RH条件下暴露2 h后的Bode图

Fig.3 Bode plots of the comb-like Cu electrodes with surface deposition of 40 µg/cm2 ammonium sulfate (a) and sodium sulfate (b) after exposure for 2 h at 30 ℃ under different humidity conditions