Sn/Cu互连体系界面和金属间化合物层Kirkendall空洞演化和生长动力学的晶体相场法模拟*
马文婧,柯常波,周敏波,梁水保,张新平(
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PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM
Wenjing MA,Changbo KE,Minbo ZHOU,Shuibao LIANG,Xinping ZHANG()
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图5. 不同Cu3Sn层厚度时Cu/Cu3Sn界面Kirkendall空洞数量随时间的变化关系
Fig.5. Time dependences of Kirkendall void number at the Cu/Cu3Sn interface with different Cu3Sn layer thicknesses
