CORROSION FAILURE OF COMPLEX ELECTRICAL CONDUCTIVE MATIERALS FILLED WITH COPPER AND SILVER POWDERS

J Chin Soc Corr Pro

2005, Vol. 25

Issue (4): 245-249 DOI:

Research Report

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CORROSION FAILURE OF COMPLEX ELECTRICAL CONDUCTIVE MATIERALS FILLED WITH COPPER AND SILVER POWDERS

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武汉大学资源与环境科学学院

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Abstract One new kind of silver-plated copper powder with high conductivity (volume resistivity of the powder is less than 2×10－4Ω·cm) was developed by the electroless plating without cyanide.The ECAs filled with this silver-plated copper powder exhibit high conductivity ( the volume resistivity of ECAs is less than 5×10－4Ω·cm when the mixing proportion of the resin to powder is 25:75 by weight) ,high migration-resistance (the shortcut time is 100 time longer than silver-filled ECAs in the migration test ) and high electric conductive stability (the volume esistivity increase is not more than 20% after 1000 hours humid-heat test in the condition of 60℃and RH100%).The mechanism of anti-migration was studied using powder microelectrode technique and other electrochemical methods.The results show galvanic coupling effect plays an important role in the anti-migration.Copper as anode restrains cathodic silver dissolved during dissolution then decreases the probability of dendritic growth.

Key words: silver-plated copper electrical conductive adhesive corrosion failure powder microelectrode

Received: 23 February 2004

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;. CORROSION FAILURE OF COMPLEX ELECTRICAL CONDUCTIVE MATIERALS FILLED WITH COPPER AND SILVER POWDERS. J Chin Soc Corr Pro, 2005, 25(4): 245-249 .

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https://www.jcscp.org/EN/ OR https://www.jcscp.org/EN/Y2005/V25/I4/245

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