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| INFLUENCE OF Ga ON ANTI—OXIDATION OF MOLTEN EUTECTIC Sn-Pb SOLDER |
| Wu Shenqing and Jiang Wenbiao (Nanjing Institute of Technoloqy) |
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Abstract Under conditions of simulating dip-soldering and wave-soldering, the oxidizability and solderability of molten NG solder developed recently by the authors were investigated and compared with those of HLSnPb39 and H63A solders made in Japan. The drossing weight of NG solder was about onefourth of that of HLSnPb 39 or H63A solder, which showed that NG solder was better than the other two solders in anti-oxidation. Experiments also showed that the wettability of NG solder was 40％ larger than that of HLSnPb39 solder. Results examined by SEM and AES show that the additional element Ga is highly enriched on the surface of NG solder. A dense and very thin film exists on the surface.
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Received: 25 August 1988
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[1] 江苏电子工业综合技术研究所,电子元器件可焊性资料汇编,(1982)
[2] Scully, J. C., The Fundamentals of Corrosion, Pergamon International Liberary, (1975)
[3] Evans, U.R., The Corrosion and Oxidation of Metals, London, P.789, (1960)
[4] Stoneman, A.M.; Mackay, C.A.; Thwaites, C. J., (?)ation and Drossing of Molten Solders: Effects of Impurities, Metals Tech. 7, 226 (1980)
[5] Hoar, T. P.; Price, L. E., Trans. Faraday Soc. 867 (1938) |
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