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Journal of Chinese Society for Corrosion and protection  2018, Vol. 38 Issue (2): 140-146    DOI: 10.11902/1005.4537.2018.007
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Electrochemical Deposition of Polypyrrole Coating on Copper from Aqueous Phytate Solution and Its Application in Corrosion Protection
Na GUO, Yanhua LEI(), Tao LIU, Xueting CHANG, Yansheng YIN
College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
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Abstract  

Phytic acid (C6H18O24P6, Phy) is the principal storage form of phosphorus in many plant tissues, especially bran, corn and seeds. Herein, high protective and stabile polypyrrole (PPy) films were directly electro-synthesized on Cu from aqueous phytic acid solution. The electrodeposition process was monitored with an electrochemical quartz crystal microbalance (EQCM), while the prepared PPy films were characterized by means of SEM, FT-IR and Raman spectroscopy. It was indicated that the growth of these films was facilitated by the initial oxidation of the Cu-electrode in the phytate solution to generate a Cu-phytate pseudo-passive layer. After that, highly adherent and homogenous polypyrrole was facilitated were electrodeposited on Cu in the phytic acid solution. Corrosion protection property of the PPy films were examined through immersion test in 3.5%(mass fraction)NaCl solution in terms of the amount of Cu ions dissolved from the PPy covered Cu during immersion, which presented the excellent stability and corrosion protective ability of the PPy films. Among others, the PPy film synthesized from the pH=4 phytic acid solution exhibited the best protective performance. EQCM-CV tests indicated that the PPy film doped with phytate anions, acting as cationic perm-selective membrane, can effectively inhibit the diffusion of Cl- to the substrate and therewith improve the anti-corrosion property.

Key words:  polypyrrole      copper      corrosion protection      EQCM      phytic acid     
Received:  05 January 2018     
Fund: Supported by National Key R&D Program of China (2016YFB0300704), National Basic Research Program of China (2014CB643306) and National Natural Science Foundation of China (51602195)

Cite this article: 

Na GUO, Yanhua LEI, Tao LIU, Xueting CHANG, Yansheng YIN. Electrochemical Deposition of Polypyrrole Coating on Copper from Aqueous Phytate Solution and Its Application in Corrosion Protection. Journal of Chinese Society for Corrosion and protection, 2018, 38(2): 140-146.

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https://www.jcscp.org/EN/10.11902/1005.4537.2018.007     OR     https://www.jcscp.org/EN/Y2018/V38/I2/140

Fig.1  Schematic diagram of the preparation of PPy polymerization
Fig.2  Variations of potential and mass change of Au (a) and Cu (b) electrodes with electric quantity during PPy polymerization (the dot line in Fig.2b indicates the mass change of the Cu electrode during Cu dissolution, if assumed that Cu was oxidized to form Cu2+)
Fig.3  A potential transition of Cu electrode during the PPy deposition (a), the Galvanostatic oxidation of Cu in phytate solution containing Py monomer was interrupted when the potential was 0.3 V (Point A) and 0.9 V (Point B), IR-RAS (b) and XPS (c) spectra of the phytate solution on stainless steel and the Cu electrode treated with surface polymerization up to A and B points
Fig.4  SEM images of the surface of Cu electrode when the potential was 0 (a), 0.3 V (b) and 0.9 V (c) during PPy polymerization
Fig.5  A schematic of electrodeposition process of PPy on copper in phytate solution
Fig.6  SEM image of the PPy film formed on copper under constant current (a) and the magnified image (b)
Fig.7  Changes of OCP of the copper electrodes without and with different PPy films in 3.5%NaCl solution (a) and the amounts of the copper ions dissolved from the copper electrodes after 480 h immersion (b)
Fig.8  Polarization curves of bare and PPy-coated copper electrodes in 3.5%NaCl solution (a scan speed of 2 mV/s)
Fig.9  Cyclic voltammetry curves of Au electrode with PPy-Phy film in 3.5%NaCl solution (the potential sweep rate was 5 mV s-1) (a), and its mass change in the 15th cycle (b)
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