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无铅焊料在NaCl-Na2SO4-Na2CO3模拟土壤溶液中的腐蚀浸出行为 |
王丽华,程从前,杨芬,赵杰 |
大连理工大学材料学院 大连 116085 |
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LEACHING BEHAVIOR OF LEAD-FREE SOLDERS IN A NaCl-Na2SO4-Na2CO3 MIXED SOLUTION AS SIMULATED SOIL |
WANG Lihua, CHENG Congqian, YANG Fen, ZHAO Jie |
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085 |
[1] Ma X, He P. Lead-free Soldering Technology in Electronic Packaging [M]. Harbin: Harbin Institute of Technology Press, 2005 (马鑫, 何鹏. 电子组装中的无铅软钎焊技术 [M]. 哈尔滨: 哈尔滨工业大学出版社, 2005)[2] Wang S Z. An experimental method for recovering silver from waste fixing bath [J]. Northern Environ., 2004, 29(1): 53-54 (王诗哲. 从废定影液中回收银的一种实验方法 [J]. 北方环境, 2004, 29(1): 53-54)[3] Lim S R, Schoenung J M. Human health and ecological toxicity potentials due to heavy metal content in waste electronic devices with flat panel displays [J]. J. Hazardous Mater., 2010, 177: 251-259[4] Subramanian K S, Ssastri V S, Elboujdaini M, et al. Water contamination-impact of tin-lead solder [J]. Water Res., 1995, 29(6): 1827-1836[5] Townsend T, Musson S, Dubey B, et al. Leachability of printed wire boards containing leaded and lead-free solder [J]. J. Environ. Manage., 2008, 88: 926-931[6] Mori M, Miura K, Sasaki T, et al. Corrosion of tin alloys in sulfuric and nitric acids [J]. Corros.Sci., 2002, 44(6): 887-898[7] Zhao J, Meng X M, Chen C, et al. Leaching behavior of heavy metal elements in lead free solders [J]. Environ. Sci., 2008, 29(8): 2341-2344 (赵杰, 孟宪明, 陈忱等. 无铅焊料合金中重金属元素浸出行为的研究 [J]. 环境科学, 2008, 29(8): 2341-2344)[8] Fan Z G, Zhao J, Meng X M, et al. Leaching behavior of heavy metal elements in SnAgCu solder [J]. Mater. Prot., 2008, 41(6): 5-7 (樊志罡, 赵杰, 孟宪明等. SnAgCu无铅焊料元素浸出行为研究 [J]. 材料保护, 2008, 41(6): 5-7)[9] Yang F, Wang L H, Zhao J, et al. Comparison of corrosion behavior of soldering alloys and joints [A]. Fracture Mechanics 2009: Evaluation, Inspection and Monitoring of Structural Integrity[C]. 2009: 501-505[10] Cao C N. Material Corrosion in Natural Environment in China [M]. Beijing: Chemical Industry Press, 2005 (曹楚南. 中国材料的自然环境腐蚀 [M]. 北京: 化学工业出版社, 2005)[11] Lao J C. Manual of Analysis on Soil Agrochemical [M]. Beijing: Agriculture Press, 1988: 12 (劳家柽. 土壤农化分析手册 [M]. 北京: 农业出版社, 1988: 12)[12] Li B, Wang J, Yang X Q, et al. The influence of extracting solution with different pH on the leaching behavior of heavy metals [J]. China Cement, 2010, 5: 60-64 (李波, 王君, 杨学权等. 不同pH浸取液对重金属长期浸出行为的影响 [J]. 中国水泥, 2010, 5: 60-64)[13] House C I, Kelsall G H . Potential-pH diagram for the Sn/H2O-Cl system [J].Electrochim. Acta, 1984, 29(10): 1459-1464[14] Mohanty U S, Lin K L. The effect of alloying element gallium on the polarisation characteristics of Pb-free Sn-Zn-Ag-Al-xGa solders in NaCl solution [J]. Corros. Sci., 2006, 48(3): 662-678[15] Mohran, H S, El-Sayed A R, El-Lateef H M A. Anodic behavior of tin, indium, and tin-indium alloys in oxalic acid solution [J]. J. Solid State Electrochem., 2009, 13: 1279-1290 |
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