添加剂对四羟丙基乙二胺（THPED）化学镀厚铜的影响

中国腐蚀与防护学报

2011, Vol. 31

Issue (5): 362-366

研究报告

本期目录 | 过刊浏览

添加剂对四羟丙基乙二胺（THPED）化学镀厚铜的影响

申晓妮^1,2,赵冬梅¹,任凤章¹,田保红¹

1. 河南科技大学材料科学与工程学院洛阳 471003
2. 河南省有色金属材料科学与加工技术重点实验室洛阳 471003

INFLUENCES OF ADDITIVES ON ELECTROLESS THICK COPPER PLATING BASED ON THPED SYSTEM

SHEN Xiaoni^1,2, ZHAO Dongmei¹, REN Fengzhang¹, TIAN Baohong¹

1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003
2. Henan Key Laboratory of Advanced Nonferrous Metal Materials,Luoyang 471003

全文: PDF(1006 KB)

摘要: 为开发THPED-EDTA•2Na化学镀厚铜工艺，研究了添加剂L-精氨酸，聚乙二醇（PEG）和亚铁氰化钾（K₄Fe(CN)₆）对化学镀速、镀层质量及镀液稳定性的影响。结果表明，适量L-精氨酸能显著提高化学镀速，其适宜的添加量为0.15 mg•L^-1； PEG和K₄Fe(CN)₆使铜还原速率有所降低，但均能改善镀层外观质量，其适宜的添加剂用量分别为150 mg•L^-1 和20 mg•L^-1。三种添加剂均能提高镀液稳定性，混合添加剂稳定性最高，80℃下稳定时间近5 h。在适宜条件下镀速为7.10 μm•h^-1，施镀15 min后获得的镀层表面平整、晶粒细致和外观红亮。沉积层为立方晶系铜，且在(111)晶面择优沉积，背光级数达到10级。

关键词 ：添加剂, 化学镀厚铜, 四羟丙基乙二胺, L-精氨酸, K₄Fe(CN)₆, 聚乙二醇

Abstract：The influences of additives on plating rate, coating quality and bath stability were investigated to develop THPED-EDTA•2Na thick copper plating process. The plating rate is obviously increased by proper amount of L-arginine, and its proper dosage is 0.15 mg•L^-1; the coating quality is greatly improved by proper amount of PEG and ferrous potassium cyanide in spite of slight decrease of plating rate, and the proper amount are 150 mg•L^-1and 20 mg•L^-1, respectively. The stability of bath is enhanced by all these additives and the stability time of bath in which mixed additives is added reaches the highest of 5 h at 80℃. The plating rate is 7.10 μm•h^-1 and the backlight level achieves 10th grade under appropriate conditions after plating for 15 min. The coating is red, bright and uniform, the sedimentary layer is cubic copper and the crystal of copper coating is mainly assigned to the (111) face.

Key words： additive electroless thick Cu plating THPED L-arginine ferrous potassium cyanide PEG

收稿日期: 2010-07-21

ZTFLH:

TQ153.14

基金资助:

国家自然科学基金项目（50771042）和河南省基础与前沿技术研究计划项目（092300410064）资助

通讯作者: 任凤章 E-mail: lyrenfz@163.com

Corresponding author: REN Fengzhang E-mail: lyrenfz@163.com

作者简介: 申晓妮，女，1982年生，硕士生，研究方向为电沉积、腐蚀与防护

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引用本文:

申晓妮,赵冬梅,任凤章,田保红. 添加剂对四羟丙基乙二胺（THPED）化学镀厚铜的影响[J]. 中国腐蚀与防护学报, 2011, 31(5): 362-366.
SHEN Xiao-Ni, DIAO Dong-Mei, REN Feng-Zhang, TIAN Bao-Hong. INFLUENCES OF ADDITIVES ON ELECTROLESS THICK COPPER PLATING BASED ON THPED SYSTEM. J Chin Soc Corr Pro, 2011, 31(5): 362-366.

链接本文:

https://www.jcscp.org/CN/ 或 https://www.jcscp.org/CN/Y2011/V31/I5/362

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