Ni-P非晶合金注入Cr~+层的电化学行为

中国腐蚀与防护学报

1989, Vol. 9

Issue (1): 63-66

研究报告

本期目录 | 过刊浏览

Ni-P非晶合金注入Cr~+层的电化学行为

王继荫;单国友

中国科学院金属腐蚀与防护研究所;中国科学院金属腐蚀与防护研究所

ELECTROCHEMICAL BEHAVIOUR OF Cr ION IMPLANTE D Ni-P AMORPHOUS ALLOY

Wang Jiyin and Shan Guoyou (Institute of Corrosion and Protection of Metals Academia Sinica)

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摘要: <正> 近来离子注入已被广泛地用于改善金属与合金表面层的性能。本试验采用离子注入技术将三种剂量(1,3,5×10~(17)Cr/Cm~2)的铬离子,在150kev,注入到电沉积非晶态 Ni-P 合金中。真空室中残余气体中的 C 通过吸咐-扩散进入注入层,从而形成表面非晶态 Ni-Cr-P-C 合金。采用阳极极化研究了该表层非晶态合金在1 M H~2SO_4。及1 M HCl 中的活化-钝化行为与耐点蚀的能力。

Abstract：Electrodeposited Ni-P amorphous alloy was implanted with chromiu at 150 keV in dosage of(1,3,5)×10~(17)ions·cm~(=2). During implantation of Cr~+ ion,carbon from the residual gases in the vacuum chamber could reach the implanting layer assisted by absorption- diffusion and formed Ni-Cr-P-C layer on the surface of Ni-P. The distribution of Ni,Cr,P and C in the implanted layer was examined by means of SIMS.TEM observation proved that the surface Ni-Cr-P-C was amorphous. The modification of the corrosion properties of the amorphous surface alloys was studied by dynamic polarization in 1M H_2SO_4 and 1M HCl. The experimental results showed that Cr-implantation not only had beneficial effect on the active-passive behavior of electrodeposited Ni-P in 1M H_2SO_4,but also increased,the pitting resistance of the Ni-P in the 1M HCl solution.

收稿日期: 1989-02-25

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王继荫;单国友. Ni-P非晶合金注入Cr~+层的电化学行为[J]. 中国腐蚀与防护学报, 1989, 9(1): 63-66.
. ELECTROCHEMICAL BEHAVIOUR OF Cr ION IMPLANTE D Ni-P AMORPHOUS ALLOY. J Chin Soc Corr Pro, 1989, 9(1): 63-66.

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https://www.jcscp.org/CN/ 或 https://www.jcscp.org/CN/Y1989/V9/I1/63

[1] Clayton,C.R.,et al,Ion implantation into Metal,Ashworth,Ed Pergamon press,Oxford and New York.(1982)
[2] Clayton,C.R.,Nuclear Instruments and Methods 182/183 865(1981)
[3] Wang Jiyin,Shan Guoyou,Proceedings of Conference 26 Australasian Corrosion Association Inc.,Vol.Ⅲ,(1986)
[4] Singer,I.L.,J.Vac.Sci.Technol.,A,1(2) ,421(1983)
[5] Singer,I.L.,Appl.Phys.Lett,43,457(1983)
[6] Dillich,S.A.,et al,Thin Solid Films,108,219(1983)
[7] Hashimoto,K.,et al,防腐技术,26,445(1977)
[8] Hashimoto,K.,et al,Proceedings of the 8th ICMC,1,70(1981)

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