铜镍合金表面膜对其电化学行为的影响

中国腐蚀与防护学报

1987, Vol. 7

Issue (2): 143-146

研究报告

本期目录 | 过刊浏览

铜镍合金表面膜对其电化学行为的影响

张哲;姚禄安;甘复兴

武汉大学;武汉大学;武汉大学

THE EFFECT OF SURFACE FILM ON ELECTROCHEMICAL BEHAVIOR OF Cu-Ni-ALLOY

Zhang Zhe Yao Luan and Gan Fuxing(Wuhan University)

全文: PDF(360 KB)

摘要: <正> 一、引言铜及铜基合金在含氯离子介质中,表面可形成一层氧化膜,许多研究工作者对此进行了大量的研究。Kruger考察了蒸馏水中铜表面膜的生长动力学。Blundy指出Cu-Ni合金表面膜的主要组份为Cu_2O,合金元素Ni、Fe不影响Cu_2O膜的结构。膜中也发现有少量的Cu_2(OH)_3Cl,有时发生偏聚,形成岛状沉积。关于膜的厚度,文献中报导不一,一般为几千埃。目前多数人认为,铜及铜合金在含氯离子介质中的耐蚀性是由于表面生成的这一层氧化膜,但对这层膜影响金属腐蚀的具体机制研究得较少,多数文献只讨论了极化组抗Rp的变化。本文作者用电化学方法,结合表面分析结果,对铜镍合金B-30(以下简称B-30)生成表面膜过程中及生成表面膜后的电化学反应机制进行了讨论;对电化学极化过程,和浸泡过程中所形成的表面膜的性能进行了比较,对其差异进行了初步探讨。

Abstract：The electrochemical behavior of alloy of Cu-Ni30 with film produced in 3％NaCl solution was studied by means of the electrochemical methods. This film prohibites anodic dissolution, it is just like a resistance. The cathodic reaction is stitl the reduction of oxygen in spite of being inhibited by the film, The difference between films produced by electrochemical polarrization and by immersed in 3％ NaCl solution are discussed.

收稿日期: 1987-04-25

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引用本文:

张哲;姚禄安;甘复兴. 铜镍合金表面膜对其电化学行为的影响[J]. 中国腐蚀与防护学报, 1987, 7(2): 143-146.
. THE EFFECT OF SURFACE FILM ON ELECTROCHEMICAL BEHAVIOR OF Cu-Ni-ALLOY. J Chin Soc Corr Pro, 1987, 7(2): 143-146.

链接本文:

https://www.jcscp.org/CN/ 或 https://www.jcscp.org/CN/Y1987/V7/I2/143

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[10] 张哲,姚录安,甘复兴,中国腐蚀与防护学报,6(2) ,103(1986)

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